March 23, 2007
NTT Advanced Technology Corporation
NTT Advanced Technology Corporation
Faulty composition of nitride semiconductor epitaxial substrates for electron devices
NTT Advanced Technology Corporation has been manufacturing and selling "nitride semiconductor epitaxial substrates," which are expected to have applications in high power amplifiers and high voltage power converters used in mobile base stations of third, and subsequent, generation mobile communication systems.
Recently, we have sold "InAlN/GaN epitaxial substrates" for research and development purposes. However, it has been found that its composition is not as intended, but is AlGaN/GaN. (*Note)
We sincerely apologize for the great inconvenience the sale of these nitride semiconductor epitaxial substrates with unintended composition has caused to our customers.
We are currently examining how the crystal growth mechanism used has led to the growth of an AlGaN layer instead of the intended InAlN layer.
In order to prevent such faulty products from being shipped again, we are modifying our shipping inspection method to include composition analysis in addition to the existing X-ray analysis and electron concentration measurement.
Recently, we have sold "InAlN/GaN epitaxial substrates" for research and development purposes. However, it has been found that its composition is not as intended, but is AlGaN/GaN. (*Note)
We sincerely apologize for the great inconvenience the sale of these nitride semiconductor epitaxial substrates with unintended composition has caused to our customers.
We are currently examining how the crystal growth mechanism used has led to the growth of an AlGaN layer instead of the intended InAlN layer.
In order to prevent such faulty products from being shipped again, we are modifying our shipping inspection method to include composition analysis in addition to the existing X-ray analysis and electron concentration measurement.
*Note: A nitride semiconductor epitaxial substrate is fabricated by growing a crystal on a sapphire or silicon substrate. The epitaxial substrate (InAlN/GaN) consisting of a crystal layer of indium (In), aluminum (Al) and nitrogen (N) and a crystal layer of gallium (Ga) and nitrogen (N). This epitaxial substrate features high voltage tolerance and high electron concentration, making it a promising material for high power devices.
For inquiries, contact
Nano-Electronics Business UnitLeading-Edge Key Technology Business Headquarters
NTT Advanced Technology Corporation
TEL: +81 46 250 3344
FAX: +81 46 270 2439
