Cleaning, Oxidation and Annealing
Cleaning: using Organic solvents and Acid / Alkali solvents.
| Organic cleaning | Acetone cleaning, Alcohol cleaning |
|---|---|
| Acid/alkai solvents |
|
- Cleaning with Acid / Alkali solvents in order to remove the residual layer.
- Wafers are cleaned with the immersion-cleaning method. For the drying, N2 blow or spin-dry method is used.
Oxidation and Annealing
Oxidation and Annealing services using an electric furnace
Annealing in a Nitrogen atmosphere
| Oxidation | Wet oxidation, Dry oxidation |
|---|---|
| Annealing | High temperature annealing (800-1000°C), Low temperature annealing (around 400°C) |
Annealing in a Nitrogen atmosphere
| Notes : | This content may be subject to change without notice. These stated pattern features and structures are representative and not guaranteed. Actual pattern features and structures are determined by the conditions and make-up of the samples and the required pattern structures, etc. |
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