Metal deposition

Various metal deposition process available using resistance heating, EB deposition, sputtering, etc.
Metal patterning using the 2 layer resist (lift-off) is also available.

Specifications

Equipment	Available metals	Available wafers	Available sizes
Resistance heating	Au, Cr, Au-based alloys	GaAs, InP, Si, Quartz, SiC, GaN	2inch phi, non-standard size wafer (< 2inch phi)
Electron beam evaporation	Ti, Pt, Au, Cr, AuGe, Al, Ni		2, 3, 4, 6inch phi, non-standard size wafer
Sputtering	Au		2, 3inch phi

Advantages

EB evaporation achieves high purity film deposition compared to resistance heating.
Other metal material available with EB evaporation.
Please contact us for the details
Able to provide metal etching for semiconductor devices
Patterning with Au plating is available

Page Top

Examples (SEM images)

The following patterns are fabricated on some substrates using two-layer resist method with reduced projection exposure and metal laminate deposition with EB evaporation.


metal dot	metal mesh


ultra fine metal (Ti/Au) (width:400nmn)	nano dot (Au=50nmφ)

Page Top

Notes :

This content may be subject to change without notice.
These stated pattern features and structures are representative and not guaranteed.
Actual pattern features and structures are determined by the conditions and make-up of the samples and the required pattern structures, etc.

Link

Inquiry