Nanofabrication process services

100kV high accelerating EB lithography equipment

• Variable shape beam and spot beam
• Si, Quartz, insulating film, various metal films, etc.
• 20nm ultra fine resist patterns
• Circular patterns for storage media, FZP patterns, etc.
• Overlay lithography

Pattern examples

20nm diameter hole pattern

Circular pattern

Photo lithography

• Si, Quartz, and Glass substrate
• Thick resist patterns (resist thickness: thicker than 10μm)
• Curved line for waveguide and other applications
• Circular patterns
• Overlay exposure

Pattern examples

Spherical pattern

Cylinder pattern

Etching equipment (ECR)

Dry etching

• Ultra fine patterns (i.e. 20nm)
• Metal patterning : Ta, Au, Pt, Cr, Permalloy, etc.
• High refractive index patterning : Ta2O5 etc
• Carbon film patterning : Glassy Carbon, SiC
• Multilayer film patterning : SiO2/Ta2O5 etc.
• Conical structure patterning : Si
• Stencil fabrication (through-hole) : SiC, SiN, Ta

Wet etching

• Anisotropic etching :
  V-groove, blaze structure, membrane fabrication (Si)

Ion beam etching

• Pin hole fabrication on metal film, etc.

Sputtering equipment

CVD equipment

• Low stress SiC film, SiN film : For membranes, etc.
• Low temperatureSiO2 film : Deposition on resin

Sputtering equipment

• Low stress Ta film : Patterning on membranes
• Low temperatureSiO2 film :
  Deposition on resin
  X-ray absorber, high melting point
• Other metal film : Au, TiN, SiO2, Si

Deposition

• Metal film : Au, Pt, Ti, Cr, etc.