Post processing (Polishing, Dicing and Au wire bonding)
NTT-AT provides post processing services, such as wafer polishing, dicing / cleaving, and Au wire bonding.
Wafer polishing
NTT-AT provides polishing services using our polishing machines, abrasive compounds and polishing jigs to meet different needs.
| Available wafers |
Available sizes |
| GaAs, InP |
2, 3 inch phi, non-standard size wafer |
Dicing / Cleaving
NTT-AT provides Dicing services mainly for Si, sapphire and LiNbO
3 substrates and Cleaving services mainly for InP,GaAs substrates by using our precise diamond blade and precise processing equipment.
| Available wafers |
Available sizes |
OPTIONS |
| GaAs, InP, Si, LiNbO3, quartz, sapphire, LT, SiC |
2, 3, 6 inch phi, non-standard size wafer |
Chipping with cleaving, Chip removal, Removal of cover resist for dicing, Chip cleaning |
Dicing example (Si substrate) |
Au wire bonding
NTT-AT conducts Au wiring between a package and an electronic device or an optical device, and Chip mount service is also available as an optional extra.
| ex1) |
Au wiring with wedge bonder |
| ex2) |
Au wiring with ball bonder |
| Notes : |
This content may be subject to change without notice.
These stated pattern features and structures are representative and not guaranteed.
Actual pattern features and structures are determined by the conditions and make-up of the samples and the required pattern structures, etc. |
