Polishing, Cleaving, Dicing, Bonding

• Wafer surface polishing, wafer backside polishing, thinning, etc.
• Depending on different needs, various polishing machines, polishing materials available

Available wafers	Available sizes
GaAs, InP	2, 3 inch phi, non-standard size wafer

InP, GaAs, Si, Quartz and Sapphire substrate using high precision diamond blade and high precision process machine.

Available wafers	Available sizes	OPTIONS
GaAs, InP, Si, LiNbO3, quartz, sapphire, LT, SiC	2, 3, 6 inch phi, non-standard size wafer	Chipping with cleaving, Chip removal, Removal of cover resist for dicing, Chip cleaning

Dicing example (Si substrate)

We also provide "removal of protective film for dicing (such as resist)" and "cleaning" as well.

InP wafer, GaAs wafer using diamond pencil, scribing tool and braking tool for auto-cleaving.

Mounting of electrical devices and optical device chip and Au wire bonding available

ex1) Au wiring with wedge bonder	ex2) Au wiring with ball bonde

Notes :

This content may be subject to change without notice. These stated pattern features and structures are representative and not guaranteed. Actual pattern features and structures are determined by the conditions and make-up of the samples and the required pattern structures, etc.