Semiconductor Process Service

- Let's solve your problems together!! -

We provide "total technology support" for your semiconductor device development, as the ideal partner for outsourcing semiconductor process developments.

"Spot process" service (Service-lineups)

Thin film formation	Metal deposition	Insulating film deposition
Microfabrication	Fine patterning	Etching
Front-end processing	Wafer cleaning, Oxidation, Annealing
Post processing	Polishing, Dicing, Au wire bonding
Evaluation / Measurement	Surface inspection

"Total process" service (Device production for R & D trial use, etc)

NTT-AT provides the fabrication of semiconductor devices (e.g. laser diodes, FETs, etc.) for R & D trial use, by using our various processing techniques and experiences.

Process service for MEMS devices on Si substrate
Trial production of R & D use devices by integrating our available process technologies
Image flow chart of "Total process" (PDF)

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NTT-AT offers our skills and techniques, accumulated over 30 years in the semiconductor business,

when you are looking for a partner who can undertake microfabrication for R & D trial use.
when you require small-lot microfabrication of a semiconductor device.
when you don't have suitable equipment to implement your ideas.
when you require support with microfabrcation techniques.

Please feel free to discuss your requirements for semiconductor processes, from Si process to GaAs, InP and LiNbO3 process.
Our professional team can satisfy your needs.

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Notes :

This content may be subject to change without notice.
These stated pattern features and structures are representative and not guaranteed.
Actual pattern features and structures are determined by the conditions and make-up of the samples and the required pattern structures, etc.

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