Semiconductors and LSIs

Fabrication and Evaluation Technologies for ITOX-SIMOX Wafers

Technology for forming buried oxide insulators below the surface of Silicon substrates to isolate devices from Si substrates by the SIMOX (Separation by Implanted Oxygen) technique including ITOX (Internal Thermal Oxidation) to make high quality wafers. In addition, the technology for evaluating the quality of ITOX-SIMOX wafers.

SIMOX-IP-LSI Devices Design and Process Technologies

Device configuration and process technology for intelligent power LSIs, integrating both high-voltage devices and LSIs utilizing SOI (Silicon on Insulators), such as SIMOX.

0.2-µm CMOS/SIMOX LSI Process Technologies

Fully-depleted ultra-thin film 0.2-µm CMOS/SIMOX LSI process technology which achieves the low-voltage, low power consumption, and high speed LSIs. Such LSI technology lies at the heart of info-communication systems which need higher speed and lower power consumption operation.

Low-Voltage LSI Design and Process Technologies

1V CMOS-LSI design and process technology that simultaneously offers high-speed and low power characteristics, using a combination of low-threshold voltage and high-threshold voltage transistors. Extremely effective when used in super small portable electronic equipment.

High-Speed Bipolar LSIs (SST) Process Technologies

Technology for fabrication of high-speed bipolar silicon LSIs with pattern resolution of less than 1µm, even with photolithography utilizing self-alignment techniques.

High-Speed and High-Frequency GaAs LSIs (SAINT) Process Technologies

Self-alignment techniques for the gate formation called SAINT(Self-aligned implantation for N+ layer technology), resulting in improved Giga-bits GaAs digital LSIs and MMICs.

Ultra-High-Speed and High-Frequency HBT IC Process and Circuit-Design Technologies

IC process and circuit design technologies for AlGaAs/GaAs HBTs(Hetero-Junction Bipolar Transistor) on GaAs which operate over 60 GHz and offer Giga-bits, digital Ics, and microwave/millimeter wave high-performance MMICs.

3-Dimensional MMIC Passive Circuit Fabrication and Circuit-Design Technologies

3-D MMIC process technology which forms a small analog IC with three-dimensional wiring(passive) on the semiconductor wafer, such as a masterslice three-dimensional MMIC and an MMIC of high-frequency Si devices on Si wafers, using the shielding effect inside the three-dimensional wiring construction. 3-D MMIC circuit design technology and its CAD software are now available.

Cu-CVD Equipment and Process Technology

Technology for copper chemical vapor deposition (Cu-CVD) equipment and processes which can achieve low electrical resistivity with excellent step coverage with a well-controlled CVD equipment. The copper metallization process and the electrical characteristics of CMOS device/circuits are described.