Thin film fabrication

Device

Ion beam sputtering system, ion beam etching system, DC magnetron sputtering system, RF magnetron sputtering system and photolithography machine.

Materials that can be deposited Single metal film

Ag, Al, Au, Bi, Co, Cr, Cu, Fe, Mg, Mn, Mo, Nb, Ni, Pb, Pd, Pt, Re, Rh, Ru, Sn, Sc, Ta, Ti, V, W, Zr We can fabricate films of other materials if you provide them.

Alloy film

AnSn, CoNi, CoP, 45Ni-Fe, 81Ni-Fe, CoZrTa, CoCr, etc

Oxide film

Al₂O₃, B₂O₃, ITO, MgO, SiO₂, thermal oxide Si, Ta₂O₅, TiO₂, etc.

Other

B, B₄C, BN, C, CaF₂, Ge, SrF₂, MgF₂, Cr₃C₂, LiF, SrF₂, SiC, SiN, TiN, various silicides, etc.

Substrates

Usually, up to 4-inch (101.6-mm) in diameter is supported. Up to 8-inch in diameter is supported by magnetron sputtering systems. With some materials, only up to 2-inch in diameter is supported.

Film quality

We can attach the results of chemical composition analysis and impurities analysis using AES, SIMS and fluorescent X-ray analysis. Also, we will monitor the pattern configuration using an SEM.

Patterning

We provide simple patterning including mask design.
The main etching method is ion beam etching. Pattern precision is 3 mm.

1. Film for various tests, including etching test
2. Magnetic film
3. Multi-layered X-ray mirror
4. Analytical standard test sample

Examples

1. Fabrication of 5-mm SiO₂ on a plastic substrate while making the surface flat
2. Fabrication of a test sample for measuring the dielectric constant of photo-resist film or SiO₂ film
   (Patterning of 1-mm or 2-mm-diameter dielectric film which is sandwiched between Cu films)
3. Fabrication of 15-mm SiO₂ on ceramic substrate
4. Fabrication of permalloy film on glass substrate and measurement of its BH characteristics
5. Fabrication of Cu electrode film in mid-process
6. Patterning of ITO electrode terminal on glass substrate
7. Fabrication of thin-film inductor
8. Fabrication of laminated