TMSP

• Effective over wide band of frequencies (-10GHz)
• Resistivity is very low and can be adjusted (>0.1 Ωcm)
• Products of various shapes can be manufactured
  Flammability (UL94V0)

• Shielding outdoor enclosure, room and building
• Grounding case to circuit board

Today, measuring and control instruments which incorporate IC chips are used extensively in a wide range of fields, including electricity, telecommunications, gas, and transportation. These utility networks have virtually become an essential lifeline in society.
Because of their extreme importance, these instruments are protected against water, dirt, and other hazards with a metallic casing and detachable cover, the gap between which is so thin as to be undetectable by the naked eye and is sealed with a rubber gasket.
The rubber packing prevents both the leakage of water, oil or gas from inside and the intrusion of dirt or water from outside.
However, recent studies show that, due to the increasing amount of electromagnetic radiation in the environment, existing rubber packing material is responsible for the intrusion of electromagnetic waves into the metallic casing. This is because the water-tight and dust-proof insulating rubber packing provides a discontinuity in the conductive metallic casing which was supposed to prevent the intrusion of electromagnetic waves.
It is ironic that the water-tight and dust-proof protective packing provides a gap through which electromagnetic waves can intrude.
TMSP (Tsuchiya Multiple Shield Packing) has been developed to solve this problem.
Although no metallic conductive material is used, a high-level of electromagnetic shielding is achieved while maintaining the conventional mechanical sealing function. In addition, three-dimensional shapes are available to suit specific applications.