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JSAP EXPO Autumn Meeting, 2016

JSAP EXPO Autumn Meeting, 2016

Join NTT-AT at 'JSAP EXPO Autumn Meeting, 2016'.

This year at JSAP EXPO Autumn Meeting, 2016 NTT-AT will showcase 'Basic process services', 'Pressure Controllable Automatic Curing System PCOA-01T'.

We look forward to seeing you in 'JSAP EXPO Autumn Meeting, 2016'.
Please stop by our booth.

 
 
 

About JSAP EXPO Autumn Meeting, 2016

Date September 13-16, 2016
Location TOKI MESSE Exhibition Hall, Niigata, Japan
Website http://meeting.jsap.or.jp/eng/index.html
Admission Free

Details

article on exhibition
  • Basic process services
    NTT-AT gives you "total tech support" for your prototyping of semiconductor devices, so we are the outsourcing partner you can rely on for semiconductor process development.
  • Pressure Controllable Automatic Curing System PCOA-01T
    Thermal treatment in the mounting process of various devices.
  • Nanoimprint Mold
    NTT-AT can accommodate a range of needs for Nanoprint Molds, from a fine 20nm pattern for next generation lithography to the order of X μm for bio-MEMS.
  • SiC membrane, SiN membrane
    The standard sample holder for X-ray analysis and electron beam analysis.

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