High Precision Adhesives
NTT-AT provides detailed solutions that meet customers' needs for various types of optical adhesive.
Features
We recommend adhesives which can easy to fix optical components with sub-micron accuracy.
- Shrinkage rate during curing is very low (less than 0.5 %).
- Thermal expansion coefficient is small (less than 20ppm/°C).
- Using ultraviolet ray curing makes alignment easy.
Relation between shrinkage during curing and thermal expansion coefficientExcellent Durability
Bonding strength doesn't change after high temperature process at 260 °C.
No peeling after 200 cycles in the heat cycle test (simplified test)
Low shrinkage rate
Shrinkage rate during curing is 0.5% (AT3862P)
Thermal expansion coefficient is small
CTE is less than 20ppm/°C
High Precision Adhesives Inquiry
Properties
|
Model# [Main ingredient] |
Viscosity (mPa･s) |
Curing conditions [irradiation level &time] |
Curing Shrinkage Rate (%) |
Glass transition temperature Tg (°C) |
Thermal Expansion Coefficient (ppm/°C) |
Bending adhesionstrength (kgf/cm2) |
|
|---|---|---|---|---|---|---|---|
| Initial period |
121℃100％ after10h |
||||||
|
AT3862P [Epoxy] |
500,000 |
100mW/cm2 2min |
0.5 | 195 | 20 | >210 | >114 |
|
AT3916P [Epoxy] |
20,000 |
100mW/cm2 5min |
0.9 | 233 | 18 | >220 | >128 |
Cases
[Usage Examples] Fixation of a micro-ball lens
 |
 |
| Photograph image | Temperature Properties of LD Module |
