Pressure-and-heat treatment for removing bubbles in seal or adhesion resins.
Benefits / Features
Wider control range for pressure and temperature
Arbitrarily-specified pressure from 0 to 0.5 MPa is useful for pressurized applications.
Heat treatment up to 350 C is available for resin applications at high temperature, e.g., polyimide curing.
A small footprint is achieved in spite of a large chamber to load 10 wafers of 200 mm in diameter.
High performance for R&D or small production
Simple operation and easy setup of temperature and pressure promote R&D activities.
High efficiency is obtained by programmable temperature control and adjustable pressure condition.
Several safety devices
High safety is ensured by a door lock system at pressurization, an overheat protector, and safety valves for over pressure.
Specifications / Details
The compact oven is applicable to the various fields;
- A wide variety of heat-treatment processes under pressurization / depressurization
- Low oxygen cure for polyimide
- Pressure-and-heat treatment for removing bubbles in seal or adhesion resins.
- Material synthesis under pressure.
Example of Pressure-and-heat treatment
Best fitted to thermal treatment in the mounting process of semiconductor devices, etc.
|maximum 350°C (distribution ±5°C )
|press: 0 to 0.5 MPa, vac: ca. 10 Pa (ultimate)
|Max. sample size
|φ240 x H160 mm
|N2 (5-6 MPa)
|stainless steel plate (exchangeable)
|200 V?50/60 Hz?2.5 kVA
|Pressure/Vacuum Compact Clean Oven PCO-083TA