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JSAP EXPO Autumn Meeting, 2017

JSAP EXPO Autumn Meeting, 2017

Join NTT-AT at 'JSAP EXPO Autumn Meeting, 2017'.

This year at JSAP EXPO Autumn Meeting, 2017 NTT-AT will showcase 'Basic process services', 'Nanoimprint Mold', 'GaN HEMT epiwafers', 'KTN Deflector'.

We look forward to seeing you in 'JSAP EXPO Autumn Meeting, 2017'.
Please stop by our booth.

About JSAP EXPO Autumn Meeting, 2017

Date September 5-8, 2017
Location Fukuoka Kokusai Center 1F, Fukuoka, Japan
Website https://meeting.jsap.or.jp/english/jsap-expo-autumn-2017
Admission Free


article on exhibition
  • Basic process services
    NTT-AT gives you "total tech support" for your prototyping of semiconductor devices, so we are the outsourcing partner you can rely on for semiconductor process development.
  • Nanoimprint Mold
    NTT-AT can accommodate a range of needs for Nanoprint Molds, from a fine 20nm pattern for next generation lithography to the order of X μm for bio-MEMS.
  • GaN HEMT epiwafers
    GaN HEMT epiwafers with low leakage current based on our original buffer growth technique.
  • KTN Deflector
    The KTN deflector will realize new technological ideas, with ultra-high speed scanning and arbitrary scanning.

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