JSAP EXPO Autumn Meeting, 2016

Join NTT-AT at 'JSAP EXPO Autumn Meeting, 2016'.

This year at JSAP EXPO Autumn Meeting, 2016 NTT-AT will showcase 'Basic process services', 'Pressure Controllable Automatic Curing System PCOA-01T'.

We look forward to seeing you in 'JSAP EXPO Autumn Meeting, 2016'.
Please stop by our booth.

About JSAP EXPO Autumn Meeting, 2016

Date	September 13-16, 2016
Location	TOKI MESSE Exhibition Hall, Niigata, Japan
Website	http://meeting.jsap.or.jp/eng/index.html
Admission	Free

Details

article on exhibition	Basic process services NTT-AT gives you "total tech support" for your prototyping of semiconductor devices, so we are the outsourcing partner you can rely on for semiconductor process development. Pressure Controllable Automatic Curing System PCOA-01T Thermal treatment in the mounting process of various devices. Nanoimprint Mold NTT-AT can accommodate a range of needs for Nanoprint Molds, from a fine 20nm pattern for next generation lithography to the order of X μm for bio-MEMS. SiC membrane, SiN membrane The standard sample holder for X-ray analysis and electron beam analysis.

article on exhibition

Basic process services
NTT-AT gives you "total tech support" for your prototyping of semiconductor devices, so we are the outsourcing partner you can rely on for semiconductor process development.
Pressure Controllable Automatic Curing System PCOA-01T
Thermal treatment in the mounting process of various devices.
Nanoimprint Mold
NTT-AT can accommodate a range of needs for Nanoprint Molds, from a fine 20nm pattern for next generation lithography to the order of X μm for bio-MEMS.
SiC membrane, SiN membrane
The standard sample holder for X-ray analysis and electron beam analysis.